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Solder Joint Technology: Materials, Properties, and Reliability

by Tu, King-Ning | HC | LikeNew
ThriftBooks
  • (3587375)
US $74.10
Condition:
Like New
“Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, ”... Read moreabout condition
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eBay item number:375089111607
Last updated on Feb 11, 2024 02:57:55 PSTView all revisionsView all revisions

Item specifics

Condition
Like New
A book that looks new but has been read. Cover has no visible wear, and the dust jacket (if applicable) is included for hard covers. No missing or damaged pages, no creases or tears, and no underlining/highlighting of text or writing in the margins. May be very minimal identifying marks on the inside cover. Very minimal wear and tear. See the seller’s listing for full details and description of any imperfections. See all condition definitionsopens in a new window or tab
Seller Notes
“Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, ...
Binding
Hardcover
Weight
1 lbs
Product Group
Book
IsTextBook
No
ISBN
9780387388908
Publication Name
Solder Joint Technology : Materials, Properties, and Reliability
Item Length
9.3in
Publisher
Springer New York
Publication Year
2007
Series
Springer Series in Materials Science Ser.
Type
Textbook
Format
Hardcover
Language
English
Item Height
0.4in
Author
King-Ning Tu
Item Width
6.1in
Item Weight
56.1 Oz
Number of Pages
Xvi, 370 Pages

About this product

Product Information

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Product Identifiers

Publisher
Springer New York
ISBN-10
0387388907
ISBN-13
9780387388908
eBay Product ID (ePID)
57265928

Product Key Features

Author
King-Ning Tu
Publication Name
Solder Joint Technology : Materials, Properties, and Reliability
Format
Hardcover
Language
English
Publication Year
2007
Series
Springer Series in Materials Science Ser.
Type
Textbook
Number of Pages
Xvi, 370 Pages

Dimensions

Item Length
9.3in
Item Height
0.4in
Item Width
6.1in
Item Weight
56.1 Oz

Additional Product Features

Series Volume Number
92
Number of Volumes
1 Vol.
Lc Classification Number
Ta459-492
Table of Content
Copper--Tin Reactions.- Copper-Tin Reactions in Bulk Samples.- Copper-Tin Reactions in Thin-Film Samples.- Copper-Tin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of Copper-Tin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductile-to-Brittle Transition of Solder Joints Affected by Copper-Tin Reaction and Electromigration.- Thermomigration.
Copyright Date
2007
Topic
Engineering (General), Materials Science / Metals & Alloys, Electronics / Circuits / General, Physics / General
Dewey Decimal
671.56
Intended Audience
Scholarly & Professional
Dewey Edition
22
Illustrated
Yes
Genre
Technology & Engineering, Science

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