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DESIGN AND MODELING FOR 3DICS AND INTERPOSERS (WSPC SERIES By Madhavan NEW - Picture 1 of 1

Design and Modeling for 3D ICS and Interposers by Madhavan Swaminathan (2013, Hardcover)

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DESIGN AND MODELING FOR 3DICS AND INTERPOSERS (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING) By Madhavan Swaminathan, Ki Jin Han - Hardcover **BRAND NEW**.