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Microelectronic Packaging by Tetsuya Osaka, J. Walter Schultze, M. Datta (Hardcover, 2004)

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Product Information

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Product Identifiers

Publisher
Taylor & Francis Ltd
ISBN-13
9780415311908
eBay Product ID (ePID)
95478928

Product Key Features

Author
Tetsuya Osaka, J. Walter Schultze, M. Datta
Publication Name
Microelectronic Packaging
Format
Hardcover
Language
English
Subject
Engineering & Technology, Chemistry
Publication Year
2004
Type
Textbook
Number of Pages
568 Pages

Dimensions

Item Height
234mm
Item Width
156mm
Item Weight
907g

Additional Product Features

Series Title
New Trends in Electrochemical Technology
Editor
M. Datta, Tetsuya Osaka, J. Walter Schultze
Country/Region of Manufacture
United Kingdom

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Microelectronic Packaging by Tetsuya Osaka, J. Walter Schultze, M. Datta (Hardcover, 2004)

About this product

Product Information

Product Identifiers

Product Key Features

Dimensions

Additional Product Features

Best Selling in Textbooks

Diagnostic and Statistical Manual of Mental Disorders DSM-5-TR by American Psychiatric Association (2022, Trade Paperback)

Desk Reference to the Diagnostic Criteria from DSM-5-TR by American Psychiatric Association (2022, Trade Paperback)

Self Heal by Design : The Role of Micro-organisms for Health by Barbara O'Neill (2018, Trade Paperback)

Leadership : Theory and Practice by Peter G. Northouse (2021, Trade Paperback, Revised edition)

Designing Data-Intensive Applications : The Big Ideas Behind Reliable, Scalable, and Maintainable Systems by Martin Kleppmann (2017, Trade Paperback)

Research Design : Qualitative, Quantitative, and Mixed Methods Approaches by J. David Creswell and John W. Creswell (2022, Trade Paperback)

Diagnostic and Statistical Manual of Mental Disorders : DSM-5-TR by American Psychiatric Association (2022, Hardcover)

Save on Textbooks

Diagnostic and Statistical Manual of Mental Disorders DSM-5-TR Brand new

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