SOLAR CELL NO CLEAN LIQUID FLUX FOR SOLAR PANEL TABBING

leaded and lead-free rework of conventional and

surface mount circuit board assemblies. Kester

186 under MIL-F-14256, was QPL approved as

Type RMA. Although the fluxing ability approaches

that of Type RA flux, residues after soldering are

non-corrosive and non-conductive. Kester 186

has been developed for use in critical applications

where difficult assemblies are to be soldered, but

process requirements stipulate use of Type RMA

flux. Kester 186 possess high thermal stability for

soldering multi-layer assemblies which require

higher temperatures. Exposure to high preheat

temperatures does not degrade solubility of the

residue in normal cleaning solvents. There is no

surface insulation resistance degradation caused

by the flux residue. The use of a minimum of ionic

activating agents and the inactive nature of the

residue permits leaving the residue on circuit

board assemblies for many applications. The flux

residue is also moisture and fungus resistant.